AFRL Transitions 250°C Thin Film Capacitor Technology Published May 7, 2009 By Thomas Brown AFRL/RZ WRIGHT-PATTERSON AIR FORCE BASE, Ohio -- Dearborn Electronics, Inc., is using a commercialized version of an AFRL-developed diamond-like carbon as a high-temperature dielectric film, packaging the material into a stacked capacitor capable of operating at temperatures up to 250°C at 200 V. The company recently announced this thin film capacitor as a deliverable product, the remarkable features of which include a 5000 megaohm insulation resistance and an -0.5% change in capacitance when stressed at these extreme conditions. AFRL's Capacitor Research and Development team continues to spearhead this triservice program in order to scale up the manufacturing process. K-Systems and Morgan Technical Ceramics are currently streamlining the manufacturing process to enhance capacitor quality and increase production volume. This effort will improve device capacitance and voltage rating to the levels necessary for use in robust electrical power systems and high-performance electric actuators. Such upgraded systems and devices are, in turn, key components in demonstrating the integrated vehicle energy technology needed for resolving thermal management issues in advanced aircraft.